Memory IC MT47H32M16CC-37E L:B product image

MT47H32M16CC-37E L:B

  • Description:IC DRAM 512MBIT PAR 84FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:2bf1e9fed2e4 Category: Brand:

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MT47H32M16CC-37E L:B is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 512MBIT PAR 84FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT47H32M16CC-37E L:B

  • Description:IC DRAM 512MBIT PAR 84FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR2
  • Memory Size:512Mbit
  • Memory Organization:32M x 16
  • Memory Interface:Parallel
  • Clock Frequency:267 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:84-TFBGA
  • Supplier Device Package:84-FBGA (12x12.5)
  • Access Time:500 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT47H32M16CC-37E L:B

MT47H32M16CC-37E L:B

Memory IC Overview

The MT47H32M16CC-37EL:B is a Micron DDR2 SDRAM with a 512Mb capacity organized as 8 Meg x 16. It operates at a maximum data rate of 533 MT/s (DDR2-533) with a cycle time of 3.75ns and CAS latency of 4. The device uses an 84-ball FBGA package measuring 12mm by 12.5mm. It supports VDD and VDDQ voltages of 1.8V ±0.1V, features four internal banks, and includes on-die termination.

Memory IC Feature Summary

  • Supports differential data strobes for improved signal integrity
  • Includes DLL to align DQ and DQS transitions with CK
  • Features adjustable data-output drive strength
  • Complies with JEDEC clock jitter specifications

Memory IC Applications

  • Mobile phone memory systems
  • Set-top boxes
  • Digital video recorders
  • Personal digital assistants

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required system timing constraints. Confirm that the package dimensions and ball assignments align with the target PCB layout. Ensure the voltage requirements are compatible with the host controller's I/O standards before finalizing procurement.

Memory IC Selection Notes

Select this component when a 512Mb density with a 16-bit interface is required. The -37E speed grade suits applications needing up to 533 MT/s performance. Consider the 84-ball FBGA form factor for space-constrained designs requiring robust connectivity.

Memory IC Part Context

This part belongs to the Micron MT47H series of DDR2 SDRAMs. It shares architectural similarities with other devices in the family, such as the MT47H64M8 and MT47H128M4, differing primarily in organization and pin count. The CC suffix indicates a lead-free 84-ball FBGA package.

Memory IC Replacement Considerations

Compatible substitutes include other Micron DDR2 parts within the same speed grade and package family, provided they match the 8 Meg x 16 organization and 84-ball FBGA footprint.

MT47H32M16CC-37E L:BMT47H32M16CC-37E L:B

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