MT53E768M32D2ZW-046 AIT:C

$17.85

Description：IC DRAM 24GBIT 200TFBGA
Series：-
Mfr：Micron Technology Inc.
Package：Tray

SKU:02667250da3b Category: Memory IC Brand: Micron Technology Inc.

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Product introduction

MT53E768M32D2ZW-046 AIT:C is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 24GBIT 200TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT53E768M32D2ZW-046 AIT:C

Description：IC DRAM 24GBIT 200TFBGA
Series：-
Mfr：Micron Technology Inc.
Package：Tray
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - Mobile LPDDR4X
Memory Size：24Gbit
Memory Organization：768M x 32
Memory Interface：LVSTL
Clock Frequency：2.133 GHz
Write Cycle Time - Word, Page：18ns
Voltage - Supply：1.06V ~ 1.17V
Operating Temperature：-40°C ~ 95°C (TC)
Mounting Type：Surface Mount
Package / Case：200-TFBGA
Supplier Device Package：200-TFBGA (10x14.5)
Access Time：3.5 ns
Grade：Automotive
Qualification：AEC-Q100

Memory IC datasheet and documents for MT53E768M32D2ZW-046 AIT:C

MT53E768M32D2ZW-046 AIT:C

Memory IC Overview

The MT53E768M32D2ZW-046 AIT:C is a mobile LPDDR4 SDRAM component manufactured by Micron Technology. It features a total storage capacity of 24 Gbit organized as 768 M x 32 bits. The device supports a maximum clock frequency of 2.133 GHz with an access time of 3.5 ns. It operates within a voltage range of 1.06 V to 1.95 V and functions at temperatures between -40°C and +85°C. The integrated circuit is housed in a TFBGA-200 package.

Memory IC Feature Summary

Mobile LPDDR4 SDRAM technology for high-bandwidth applications
Wide 32-bit data bus interface architecture
Industrial temperature rating for extended environmental operation

Memory IC Applications

Smartphones and mobile communication devices
Tablets and portable computing platforms
Automotive infotainment systems

Memory IC Procurement Notes

Verify the specific suffix AIT:C against official Micron documentation to confirm industrial temperature grade and binning details. Confirm package type TFBGA-200 matches design requirements. Check current availability status as distribution may vary. Ensure RoHS compliance aligns with project specifications before finalizing procurement orders.

Memory IC Selection Notes

Select this part when a 24 Gbit density with a 32-bit width is required for mobile or automotive designs. The 2.133 GHz speed supports high-throughput data processing needs. The -40°C to +85°C operating range makes it suitable for environments exceeding standard commercial limits. Verify pin compatibility with existing PCB layouts using the TFBGA-200 footprint.

Memory IC Part Context

This component belongs to the Micron MT53E series, which encompasses LPDDR4 memory solutions optimized for mobile and embedded applications. The series provides scalable densities and interface widths to support diverse system memory architectures. The MT53E768M32 variant specifically addresses high-capacity requirements within the 24 Gbit class.