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MTSW-104-08-S-T-280 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is CONN HEADER VERT 12POS 2.54MM. Review the specifications below when checking this part for your BOM.
The MTSW-104-08-S-T-280 is a Flex Stack variable height PCB header strip manufactured by Samtec. It features a 2.54 mm (0.1 in) pitch with four positions arranged in three rows, totaling twelve contacts. The connector utilizes through-hole termination with solder pins and straight mounting orientation. Contact materials consist of phosphor bronze with tin plating on the mating surfaces. The housing is constructed from black polybutylene terephthalate (PBT) rated UL 94 V-0. It operates within a temperature range of -55°C to +125°C.
Verify the specific part number configuration against official Samtec documentation before procurement. Confirm that the tin-plated contact finish and PBT housing material meet the environmental and electrical requirements of the target application. Ensure the through-hole footprint matches the PCB layout specifications to guarantee proper assembly and reliable signal integrity during operation.
Select this component when a standard 2.54 mm pitch header requires customized vertical spacing between connected boards. The three-row configuration provides higher density compared to single-row alternatives. Verify that the operating temperature range and flammability rating align with the system's thermal management strategy and safety standards.
This part belongs to the MTSW series of variable height PCB header strips. The series offers flexibility in post length selection to suit various stacking needs. It complements other Samtec interconnect solutions like TSW and HW series components for comprehensive board-to-board connectivity options.
Public confirmed substitute part numbers are not available in the provided documentation.
Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.

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