PCI2050IGHK

Specialized Overview

The Texas Instruments PCI2050IGHK is an industrial-grade PCI-to-PCI bridge compliant with the PCI Local Bus Specification and PCI-to-PCI Bridge Specification 1.1. It provides a high-performance connection path between two 32-bit, 33-MHz PCI buses, allowing concurrent bridged transactions. The device features independent read/write buffers, burst-mode transfers, and internal two-tier arbitration for up to nine secondary bus masters. It operates within a temperature range of -40°C to +85°C using a 209-terminal MicroStar BGA package.

Specialized Feature Summary

• Supports CompactPCI hot-swap functionality for multifunction cards
• Features universal PCI interfaces compatible with 3.3-V and 5-V signaling environments
• Includes advanced submicron, low-power CMOS technology for power conservation

Specialized Applications

• Multifunction CompactPCI cards
• Adapting single-function cards to hot-swap compliance
• Creating hierarchical buses to overcome electrical loading limits

Specialized Procurement Notes

Verify that the component matches the specified industrial temperature range and package type. Confirm the ordering suffix corresponds to the correct voltage and thermal specifications. Ensure the datasheet version aligns with the required design parameters before finalizing procurement orders.

Specialized Selection Notes

Select this model when an industrial operating temperature range is required alongside CompactPCI hot-swap capabilities. The 209-terminal MicroStar BGA package offers a compact footprint suitable for space-constrained designs requiring robust PCI interconnectivity.

Specialized Part Context

This component belongs to the PCI2050 family of PCI-to-PCI bridges manufactured by Texas Instruments. It serves as a critical interface for expanding PCI bus architectures while maintaining signal integrity and adhering to industry standards for power management and data throughput.

Specialized Replacement Considerations

The PCI2050IPDV is a functional equivalent in a different package. Verify pin compatibility and thermal requirements when substituting components.