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Q6008N4RP is listed in the Triacs range at ChipApex. The manufacturer field lists Littelfuse Inc.. Its product description is TRIAC 600V 8A TO263. Review the specifications below when checking this part for your BOM.
The Littelfuse Q6008N4RP is a standard Triac belonging to the Qxx08xHx series, designed for general-purpose AC power control applications. It features an 8 A RMS on-state current and a 600 V rated repetitive off-state voltage. The device operates within a junction temperature range of -40 °C to +125 °C and utilizes an SMTO-263-2 surface-mount package. Key electrical characteristics include a maximum holding current of 35 mA, a gate trigger current of 35 mA, and a gate trigger voltage of 1.3 V. The component exhibits a low on-state voltage of 1.6 V and a maximum off-state leakage current of 10 µA at VDRM.
Verify the specific suffix against official Littelfuse documentation to confirm pinout compatibility and exact electrical tolerances. Ensure the ordering code matches the required SMTO-263-2 package variant. Cross-reference datasheet revisions to validate compliance with current RoHS standards before finalizing procurement specifications.
Select this component when an 8 A RMS current rating and 600 V blocking voltage are required in a compact surface-mount form factor. The 35 mA gate drive requirement suits standard logic-level or discrete driver interfaces. Verify that the SMTO-263-2 footprint aligns with the target PCB layout constraints and thermal management requirements.
This part belongs to the Littelfuse Teccor Q6008 family of standard Triacs. The 'N' designation typically indicates a specific lead-free plating or packaging configuration within the series. It shares core electrical parameters with through-hole equivalents like the Q6008L4 but offers advantages in automated assembly and board space efficiency due to its SMD construction.
Direct functional substitutes within the same series include the Q6008DH4RP, though it utilizes a TO-252-3 package rather than SMTO-263-2. Designers must verify mechanical fit and thermal dissipation capabilities when swapping between these distinct surface-mount packages.
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