QFS-016-04.25-H-D-DP-A

QFS-016-04.25-H-D-DP-A is listed in the Arrays, Edge Type, Mezzanine (Board To Board) range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is CONN DIFF ARRAY RCP 32P SMD GOLD. Review the specifications below when checking this part for your BOM.

Arrays, Edge Type, Mezzanine (Board To Board) specifications for QFS-016-04.25-H-D-DP-A

• Description：CONN DIFF ARRAY RCP 32P SMD GOLD
• Series：Power Q2™ QFS
• Mfr：Samtec Inc.
• Package：Tray,Tray
• Connector Type：Differential Pair Array, Female
• Number of Positions：32
• Pitch：0.025" (0.64mm)
• Number of Rows：2
• Mounting Type：Surface Mount
• Features：Board Guide, Ground Bus (Plane)
• Contact Finish：Gold
• Contact Finish Thickness：30.0µin (0.76µm)
• Mated Stacking Heights：10mm, 11mm, 14mm
• Height Above Board：0.278" (7.06mm)

Arrays, Edge Type, Mezzanine (Board To Board) datasheet and documents for QFS-016-04.25-H-D-DP-A

Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.