Memory IC RC28F256P33TFA product image

RC28F256P33TFA

  • Description:IC FLASH 256MBIT PAR 64EASYBGA
  • Series:Axcell™
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:f7ac6f72b141 Category: Brand:

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RC28F256P33TFA is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 256MBIT PAR 64EASYBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for RC28F256P33TFA

  • Description:IC FLASH 256MBIT PAR 64EASYBGA
  • Series:Axcell™
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:256Mbit
  • Memory Organization:16M x 16
  • Memory Interface:Parallel
  • Clock Frequency:52 MHz
  • Write Cycle Time - Word, Page:95ns
  • Voltage - Supply:2.3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:64-TBGA
  • Supplier Device Package:64-EasyBGA (8x10)
  • Access Time:95 ns

Memory IC datasheet and documents for RC28F256P33TFA

RC28F256P33TFA

Memory IC Overview

The RC28F256P33TFA is a 256 Mbit NOR flash memory device manufactured by Micron Technology. It features a 16-bit data bus width and operates within a voltage range of 2.7 V to 3.6 V. The component utilizes a 64-ball Easy BGA package, providing a compact footprint for surface-mount applications. It supports both asynchronous and synchronous burst modes, with access times typically specified at 95 ns or faster depending on the specific speed grade. The device is designed for industrial temperature ranges, ensuring reliable performance in demanding environments.

Memory IC Feature Summary

  • Supports top boot block architecture for efficient firmware storage
  • Enables individual zero-latency block locking for code protection
  • Provides suspend capabilities for program and erase operations
  • Integrates unique information programming for device identification

Memory IC Applications

  • Embedded systems requiring non-volatile code storage
  • Industrial control units needing reliable firmware retention
  • Consumer electronics utilizing boot block architectures
  • Automotive modules requiring extended temperature operation

Memory IC Procurement Notes

Verify the manufacturer designation carefully, as this part number may be associated with Alliance Memory following industry acquisitions. Confirm the exact speed grade suffix and package variant against current official datasheets. Ensure compatibility with existing board layouts regarding the 64-ball BGA pitch and pinout definitions before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when a 256 Mbit capacity with a 16-bit interface is required in a small form factor. Consider the top boot configuration if the application demands immediate execution from the first memory blocks. Evaluate the thermal requirements to ensure the -40°C to +85°C range meets the operational environment standards.

Memory IC Part Context

This part belongs to the PC28F/RC28F series of parallel NOR flash memories. It shares architectural similarities with other devices in the family, such as the JS28F256P30 series, but differs in packaging and specific electrical characteristics. The RC prefix often denotes specific regional or manufacturing variants within the broader Micron memory portfolio.

Memory IC Replacement Considerations

Public confirmed substitute part numbers include JS28F256P33TFE and PC28F256P33TFE. Verify pin-to-pin compatibility and electrical specifications before substitution.

RC28F256P33TFARC28F256P33TFA

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