S25FL256SAGBHIY00

Memory IC Overview

The S25FL256SAGBHIY00 is a 256 Mbit NOR flash memory device manufactured by Infineon Technologies. It operates within a supply voltage range of 2.7 V to 3.6 V and supports synchronous SPI interfaces with a maximum clock frequency of 133 MHz. The memory organization is specified as 32 M x 8 bits, utilizing an 8-bit data bus width. Active read current reaches a maximum of 100 mA. The component is housed in a BGA-24 package designed for surface mount technology (SMD/SMT). It functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Supports high-speed synchronous serial peripheral interface operations up to 133 MHz
• Utilizes MirrorBit technology for non-volatile data retention
• Designed for surface mount installation in compact electronic assemblies

Memory IC Applications

• Code storage in embedded systems requiring direct execution
• Data logging applications in industrial environments
• Firmware storage for consumer electronics devices

Memory IC Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm package type and tape/reel specifications. Ensure compatibility with moisture sensitivity level requirements during assembly processes. Confirm that the selected variant meets all environmental and regulatory standards applicable to your target market before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 256 Mbit capacity is required with BGA-24 packaging constraints. Ensure the design accommodates the 2.7 V to 3.6 V operating voltage window. Verify that the host controller supports the necessary synchronous SPI protocol and clock speeds up to 133 MHz for optimal performance within the specified industrial temperature range.

Memory IC Part Context

This part belongs to the S25FL256S series of NOR flash memories. The series offers various package options including BGA, SOIC, and WSON configurations. All variants share core electrical characteristics such as capacity and interface speed, differing primarily in physical footprint and shipping packaging formats defined by their unique ordering suffixes.

Memory IC Replacement Considerations

Direct substitutes include other S25FL256S variants with identical electrical specifications but different packages, such as S25FL256SAGMFI000 or S25FL256SAGNFI001. Cross-package replacements require PCB layout modifications. Verify pinout compatibility and thermal management requirements when considering alternative packages.