Memory IC S34ML04G200BHI000 product image

S34ML04G200BHI000

  • Description:IC FLASH 4GBIT PARALLEL 63BGA
  • Series:ML-2
  • Mfr:Cypress Semiconductor Corp
  • Package:Tray

SKU:0943bb2146a9 Category: Brand:

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S34ML04G200BHI000 is listed in the Memory IC range at ChipApex. The manufacturer field lists Cypress Semiconductor Corp. Its product description is IC FLASH 4GBIT PARALLEL 63BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S34ML04G200BHI000

  • Description:IC FLASH 4GBIT PARALLEL 63BGA
  • Series:ML-2
  • Mfr:Cypress Semiconductor Corp
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND
  • Memory Size:4Gbit
  • Memory Organization:512M x 8
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:25ns
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:63-VFBGA
  • Supplier Device Package:63-BGA (11x9)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for S34ML04G200BHI000

S34ML04G200BHI000

Memory IC Overview

The S34ML04G200BHI000 is a 4 Gbit Single-Level Cell (SLC) NAND flash memory from the S34ML04G2 series, manufactured by Cypress Semiconductor. It features an asynchronous parallel interface with an x8 data bus width and operates on a 3.3 V supply voltage ranging from 2.7 V to 3.6 V. The device utilizes a 63-ball BGA package and supports ONFI 1.0 compliance. Key electrical parameters include a maximum active read current of 30 mA and a maximum power supply current of 35 mA. It functions within an industrial temperature range of -40 °C to +85 °C.

Memory IC Feature Summary

  • Supports multiplane program and erase operations for enhanced throughput
  • Includes Read Cache feature to improve large file read performance
  • Provides hardware write protection via the WP# pin
  • Features an open-drain Ready/Busy output for global status signaling

Memory IC Applications

  • Embedded solid-state mass storage systems
  • Industrial control applications requiring wide temperature operation
  • Firmware and code storage in microcontroller-based designs
  • Data logging and configuration retention

Memory IC Procurement Notes

Verify that the specific ordering suffix matches the required package type and I/O width. Confirm the manufacturer designation aligns with current corporate ownership structures following industry acquisitions. Ensure compatibility with the system's voltage levels and timing requirements before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 4 Gbit capacity with an x8 interface is required in a compact BGA footprint. Consider the multiplane architecture if higher program and erase speeds are necessary compared to single-plane alternatives. Verify that the operating temperature range meets the environmental specifications of the target application.

Memory IC Part Context

This part belongs to the S34ML04G2 series of embedded NAND flash memories designed for cost-effective mass storage. The series includes variants with different densities and interfaces, such as the S34ML01G2 and S34ML02G2. The BGA package option provides a space-efficient solution for modern electronic designs requiring reliable non-volatile storage.

Memory IC Replacement Considerations

Direct substitutes within the same family include other density variants like the S34ML02G200BHI000 or interface variations such as the x16 versions. Cross-referencing with newer generations may require verification of command set compatibility and physical pin mapping.

S34ML04G200BHI000S34ML04G200BHI000

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