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S8T28F is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Rochester Electronics, LLC. Its product description is LINE TRANSCEIVER, 1 FUNC, 4 DRIV. Review the specifications below when checking this part for your BOM.
The S8T28F is a Schottky three-state quad bus driver and receiver manufactured by Rochester Electronics, LLC. It functions as a non-inverting transceiver with one element containing four bits per element. The device features a 3-state output configuration and is housed in a 16-CDIP package with a width of 0.300 inches (7.62mm). It operates within a temperature range of -55°C to 125°C (TA).
Verify the specific manufacturer date code and lot traceability upon receipt, as Rochester Electronics sources components from various original manufacturers. Confirm that the 16-CDIP package dimensions match your board layout requirements. Ensure the operating temperature range of -55°C to 125°C aligns with your system's thermal design constraints before finalizing integration.
Select this component when a Schottky-speed quad bus driver/receiver with three-state outputs is required. The 16-CDIP package is suitable for through-hole mounting applications. Consider the wide industrial temperature range if the environment exceeds standard commercial limits. Verify pin compatibility with existing designs using the 16-pin CDIP footprint.
Rochester Electronics specializes in providing lifecycle management solutions for obsolete and hard-to-find semiconductors. The S8T28F represents their distribution of legacy buffer and transceiver technologies. This part continues the availability of Schottky-based logic devices originally produced by major semiconductor manufacturers, ensuring supply continuity for long-life systems.
Direct cross-references may include other Schottky quad bus drivers in 16-CDIP packages. Verify electrical characteristics such as propagation delay and output drive strength against the original design specifications. Ensure pinout compatibility to avoid PCB redesign efforts during substitution.
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