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SM662PAC-BFSS is listed in the Memory IC range at ChipApex. The manufacturer field lists Silicon Motion, Inc.. Its product description is IC FLASH 160GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
The SM662PAC-BFSS is a NAND flash controller from Silicon Motion, Inc., part of the Ferri-eMMC family. It supports eMMC 5.1 interface and utilizes 3D TLC memory technology. The device features a BGA package configuration suitable for surface mount applications.
Verify the specific suffix BFSS against official Silicon Motion documentation to confirm exact pinout and electrical characteristics. Ensure compatibility with target PCB layout requirements for the BGA package before procurement.
Select this component for designs requiring eMMC 5.1 compliance and 3D TLC support. Evaluate thermal management needs for the BGA package in the final enclosure design.
This controller belongs to the Ferri-eMMC series by Silicon Motion, targeting cost-effective embedded storage solutions. It integrates necessary logic for managing NAND flash operations within compact form factors.
Consult official substitution lists for compatible controllers with matching interface and package specifications.
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