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SN74AHCT574DGVR is listed in the Flip Flops range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FF D-TYPE SNGL 8BIT 20TVSOP. Review the specifications below when checking this part for your BOM.
The SN74AHCT574DGVR is an octal edge-triggered D-type flip-flop with three-state outputs manufactured by Texas Instruments. It belongs to the SN74AHCT series, featuring TTL-compatible inputs and CMOS technology. The device operates within a supply voltage range of 4.5 V to 5.5 V. It provides non-inverting outputs capable of driving bus lines or multiple loads. The component is housed in a 20-pin TVSOP package designed for surface-mount applications.
Verify the specific suffix 'DGVR' corresponds to the TVSOP-20 package variant when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure design compatibility with the specified 4.5 V to 5.5 V operating voltage range. Validate thermal performance requirements against the datasheet specifications for the selected package type.
Select this component when TTL-compatible inputs are required alongside high-speed CMOS performance. The AHCT series bridges the gap between legacy TTL systems and modern low-power CMOS designs. Consider the TVSOP-20 package dimensions for PCB layout constraints. Evaluate propagation delay characteristics against system timing requirements to ensure signal integrity across the octal register array.
This part is a member of the Texas Instruments SN74AHCT family, which combines the speed of AHC logic with HCT input compatibility. It serves as a standard solution for parallel data storage and transfer in mixed-voltage environments. The device replaces older discrete flip-flop implementations, reducing board space and assembly complexity while maintaining reliable digital signal processing capabilities.
SN74AHCT574DR is available in a SOIC-20 package with identical electrical characteristics. SN74AHCT574PW offers a TSSOP-20 alternative with compatible pinout and functionality. Verify package footprint differences before substituting these variants in existing designs.
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