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SN74AS230ADW is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is BUS DRIVER, AS SERIES. Review the specifications below when checking this part for your BOM.
The SN74AS230ADW is an octal buffer and line driver from the Texas Instruments AS logic series, housed in a 20-pin SOIC package. It features eight inverting channels with three-state outputs. The device operates within a supply voltage range of 4.5 V to 5.5 V. Key electrical parameters include a propagation delay of 6.5 ns, a high-level output current of -15 mA, and a low-level output current of 64 mA. Static current consumption is specified at 11 mA, while operating power current reaches 23 mA. The component supports surface-mount installation and functions reliably across an ambient temperature range of 0°C to +70°C.
Verify the specific suffix designation against the manufacturer's official documentation to confirm pinout compatibility and electrical characteristics. Ensure the procurement source provides valid traceability records. Confirm that the delivered components match the exact part number specifications regarding package type and operational temperature ratings before integration into production systems.
Select this component when designing systems requiring high-speed octal buffering with inverting functionality. The AS series offers superior speed compared to standard TTL variants. Consider the thermal management requirements associated with the specified static current levels. Verify that the target application environment remains within the defined operating temperature limits to ensure consistent performance and reliability over the product lifecycle.
This integrated circuit belongs to the Texas Instruments SN74AS230A family, which represents a subset of the broader AS logic series. These devices are engineered for high-performance digital applications requiring fast switching speeds. The SN74AS230ADW variant specifically denotes the dual-in-line small-outline package configuration suitable for automated surface-mount assembly processes in modern electronic manufacturing environments.
Consult official substitution guides for compatible alternatives within the same logic family or equivalent performance tiers. Verify pin-to-pin compatibility and electrical parameter alignment before implementing any substitute component in existing designs.
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