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SN74BCT25244DW is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUF NON-INVERT 5.5V 24SOIC. Review the specifications below when checking this part for your BOM.
The SN74BCT25244DW is an octal buffer and line driver from Texas Instruments, belonging to the BCT logic series. It features eight non-inverting inputs and outputs housed in a 24-pin SOIC package. The device operates within a supply voltage range of 4.5 V to 5.5 V. It provides high drive capability with a maximum low-level output current of 188 mA and a maximum high-level output current of -80 mA. Propagation delay is specified at 5.6 ns at 5 V. The component supports surface-mount installation and functions within a temperature range of -40°C to +85°C.
Verify the specific datasheet revision and RoHS compliance status directly with Texas Instruments or authorized distributors before procurement. Confirm that the SOIC-24 package dimensions match your PCB footprint requirements. Ensure the operating temperature range aligns with your system's environmental conditions. Cross-reference the manufacturer part number to avoid counterfeit components.
Select this component when high drive strength is required for bus applications. The BCT series offers a balance between speed and power consumption compared to standard CMOS logic. Consider the 24-pin SOIC package for surface-mount assembly constraints. Evaluate the 3-state output functionality against other bus controller requirements in the design.
This device is part of the SN74BCT25244 family, designed for high-performance digital systems. It serves as a critical interface component for managing data flow in complex electronic architectures. The BCT technology ensures compatibility with various logic families while maintaining signal integrity over long traces.
Check for direct pin-compatible alternatives within the same BCT family. Verify electrical specifications such as output current and propagation delay for any substitute parts. Ensure the replacement maintains the same package type and operating temperature range.
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