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SN74F543DBLE is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is REGISTERED BUS TRANSCEIVER. Review the specifications below when checking this part for your BOM.
The SN74F543DBLE is an octal registered transceiver with 3-state outputs manufactured by Texas Instruments. It operates within a supply voltage range of 4.5 V to 5.5 V and supports an operating temperature range of 0°C to 70°C. The device features two sets of D-type latches for data storage, allowing independent control of data flow direction via separate latch-enable and output-enable inputs. A-to-B outputs sink up to 24 mA, while B-to-A outputs sink up to 64 mA. Propagation delays are characterized at maximum 8.5 ns for A-to-B and 7.5 ns for B-to-A transitions under standard load conditions.
Verify the specific 'E' suffix against official documentation to confirm if it denotes a specialized variant or environmental compliance marking. Confirm package availability as standard listings may prioritize DBR or DWR variants. Ensure design compatibility with the specified 0°C to 70°C operating temperature range before procurement.
Select this component when space constraints require the use of shrink small-outline packages without sacrificing I/O pin counts. Consider the asymmetric output currents when designing interface circuits; the B ports offer higher sinking capability suitable for heavier loads compared to the A ports. Ensure logic levels align with TTL input requirements for reliable operation.
This part belongs to the SN74F543 family of octal registered transceivers. It shares core functionality with variants like SN74F543DW and SN74F543DWR but utilizes the SSOP (DB) package format. The family is designed for applications needing bidirectional data transfer with storage capabilities in standard F-series logic environments.
SN74F543DBR and SN74F543DWR are confirmed substitutes offering identical electrical specifications and functionality. Verify that the package type change from SSOP to SOIC does not impact mechanical clearance in the target application.
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