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SN74GTLPH306PW is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TRANSLATOR BIDIR 24TSSOP. Review the specifications below when checking this part for your BOM.
The SN74GTLPH306PW is an 8-bit LVTTL-to-GTLP bus transceiver manufactured by Texas Instruments. It operates within a supply voltage range of 3.15 V to 3.45 V and supports data rates up to 266 MHz. The device features over-voltage tolerant inputs, partial power-down capability via Ioff, and power-up three-state functionality. It is housed in a 24-TSSOP package with a maximum propagation delay of 1.5 ns at 3.3 V. The component is designed for high-speed backplane applications, ensuring signal integrity through GTLP output standards.
Verify the specific suffix 'PW' confirms the TSSOP-24 package variant. Confirm RoHS compliance status as required by project specifications. Ensure the operating temperature range meets environmental constraints. Cross-reference the manufacturer part number against official TI documentation to avoid counterfeit components. Validate that the bidirectional nature aligns with system design requirements.
Select this component when interfacing LVTTL sources with GTLP destinations in high-speed environments. The 8-bit width suits wide data buses. Consider the 24-TSSOP package for space-constrained PCB layouts. Verify that the 3.3 V nominal supply voltage matches the system power rails. Evaluate the need for partial power-down features if low standby current is critical.
This device belongs to the SN74GTLPH series, which integrates GTLP characteristics with additional features like Ioff. It complements other level shifters in the GTLP family, such as the SN74GTLP1394. The H-series designation typically indicates enhanced features compared to standard GTLP devices, focusing on system-level benefits like power management and input tolerance.
The SN74GTLPH306PWR is a reel-manufactured equivalent offering identical electrical performance. Verify pin compatibility and package dimensions before substitution. Ensure the replacement maintains the same bidirectional channel configuration and voltage level support.
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