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SN74LS279ADE4 is listed in the Latches range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC QUAD S-R LATCHES 16-SOIC. Review the specifications below when checking this part for your BOM.
The SN74LS279ADE4 is a quad S-R latch integrated circuit manufactured by Texas Instruments. It operates within a supply voltage range of 4.75V to 5.25V and features four independent circuits. The device utilizes a 16-pin SOIC package with surface-mount installation. Key electrical parameters include a propagation delay of 27 ns at 5 V, a low-level output current of 32 mA, and a high-level output current of -400 µA. It functions as a non-inverting logic component suitable for standard TTL applications.
Verify the specific suffix 'E4' indicates environmental compliance or manufacturing revision details against the official datasheet. Confirm the SOIC-16 package dimensions match the target PCB footprint. Ensure the operating temperature range meets system requirements. Validate that the LS logic family characteristics align with the design's power and speed constraints before finalizing procurement.
Select this component when four independent latches are required in a compact surface-mount format. The LS series offers a balance of speed and power consumption suitable for general logic applications. Consider the 27 ns propagation delay for timing analysis. Verify compatibility with existing 5V logic levels and ensure the 32 mA sink capability meets load requirements.
This part belongs to the Texas Instruments SN74LS279A series of quad S-R latches. The 'DE4' designation typically denotes a specific tape-and-reel packaging variant with RoHS compliance. It is part of the broader 74LS logic family, designed for standard 5V TTL operation. The component serves as a fundamental building block for sequential logic circuits requiring multiple independent storage elements.
Direct substitutes may include other SN74LS279 variants with compatible pinouts and electrical specifications. Verify package equivalence between DIP and SOIC if form factor changes are acceptable. Cross-reference manufacturer-specific suffixes for packaging and compliance differences.
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