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SN74LS365ANSR is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUFFER NON-INVERT 5.25V 16SO. Review the specifications below when checking this part for your BOM.
The SN74LS365ANSR is a hex bus driver featuring three-state outputs, manufactured by Texas Instruments. It operates within the LS logic series and utilizes a SOIC-16 surface-mount package. The device accepts a supply voltage ranging from 4.75 V to 5.25 V. Electrical characteristics include a high-level output current of -2.6 mA and a low-level output current of 24 mA. Static current consumption is specified at 65 mA, with an operating supply current of 85 mA. The component supports a non-inverting polarity configuration and functions reliably across a temperature range of 0°C to +70°C.
Verify the specific suffix 'SR' indicates tape-and-reel packaging when sourcing. Confirm RoHS compliance status through official manufacturer documentation or authorized distributors. Ensure the SOIC-16 footprint matches the target PCB design. Validate that the LS logic family requirements align with the system's power and speed constraints before finalizing procurement.
Select this component for applications requiring standard TTL-compatible buffering with three-state control. The LS series offers a balance of speed and power consumption suitable for general-purpose digital logic. Consider the SOIC-16 package for automated assembly processes. Verify that the 5V supply voltage range meets the system's power distribution specifications.
This part belongs to the SN74LS365 family of hex bus drivers. It serves as a surface-mount variant of the through-hole SN74LS365AN. The device is part of the broader 74-series logic ecosystem, providing standardized interface capabilities for digital circuits. It complements other components like the SN74LS368, which offers inverting functionality.
The SN74LS365AN is a direct pin-to-pin replacement offering identical electrical performance in a through-hole package.
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