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SN74LVC02AMPWREP is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC GATE NOR 4CH 2-INP 14TSSOP. Review the specifications below when checking this part for your BOM.
The SN74LVC02AMPWREP is an enhanced product quad 2-input NOR gate from Texas Instruments, part of the SN74LVC02A series. It operates within a supply voltage range of 2 V to 3.6 V and features low dynamic power consumption. The device provides 24 mA high-level and low-level output drive capabilities with a propagation delay of approximately 5 ns at 3.3 V. It is housed in a 14-pin TSSOP (PW) package and supports an operating temperature range from -55°C to +125°C.
Verify the complete ordering code including the REP suffix to ensure enhanced product status. Confirm the PW package variant matches design requirements. Check datasheet for specific reliability data such as HBM and CDM ratings. Ensure compatibility with system voltage levels between 2 V and 3.6 V. Validate temperature range specifications for extreme operational conditions.
Select this component when military-grade reliability and controlled manufacturing baselines are required. It offers standard LVC logic functionality with enhanced quality controls. Consider the TSSOP-14 package for surface mount space constraints. Verify input compatibility with CMOS or TTL logic families if interfacing with legacy systems. Evaluate power consumption benefits for battery-operated or low-power applications.
This part belongs to the SN74LVC02A family of quad 2-input NOR gates. The REP suffix denotes an enhanced product version designed for demanding environments. It shares functional compatibility with standard commercial variants but includes stricter manufacturing controls. The LVC series provides low voltage operation with high speed performance suitable for modern digital logic applications.
Direct replacement requires verifying the REP suffix for enhanced product specifications. Standard SN74LVC02APW may lack the controlled baseline and reliability features. Ensure pinout and package dimensions match the existing PCB layout. Confirm voltage and temperature ranges meet application requirements.
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