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SN74LVC10ANSR is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC GATE NAND 3CH 3-INP 14SO. Review the specifications below when checking this part for your BOM.
The SN74LVC10ANSR is a triple 3-input positive-NAND gate from the Texas Instruments LVC logic family. It operates within a supply voltage range of 1.65 V to 3.6 V and features a propagation delay of 7 ns. The device contains three independent NAND circuits, each with three inputs, housed in a 14-pin SOIC package. It supports surface-mount installation and functions reliably across an operating temperature range of -40°C to +125°C.
Verify the specific ordering suffix matches the required package type and tape-and-reel quantity. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process. Ensure the supplier provides valid traceability documentation for the component batch. Cross-reference the manufacturer part number against official distributor catalogs to avoid counterfeit components.
Select this component when designing circuits that require multiple 3-input NAND gates within a single package. The LVC series is suitable for applications needing low power consumption and compatibility with 3.3 V logic levels. Consider the 14-SOIC package dimensions for PCB layout constraints. Verify input voltage thresholds align with your system's logic high and low signals.
This component belongs to the SN74LVC10A series, which includes various NAND gate configurations. The 'ANSR' suffix indicates the SOIC-14 package and reel packaging format. It is part of Texas Instruments' broader portfolio of low-voltage CMOS logic devices designed for modern portable and industrial electronics.
Check for direct pin-compatible alternatives within the same LVC family. Verify that substitute parts maintain the same 1.65 V to 3.6 V operating voltage range. Ensure replacement components offer equivalent propagation delays and package dimensions. Confirm availability of the same surface-mount packaging format.
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