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SN74LVC1G11DBVRE4 is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC GATE AND 1CH 3-INP SOT23-6. Review the specifications below when checking this part for your BOM.
The SN74LVC1G11DBVRE4 is a single three-input positive AND gate manufactured by Texas Instruments. It operates within a supply voltage range of 1.65 V to 5.5 V and features low static current consumption of 10 μA. The device provides high drive capability with output currents of ±32 mA. Propagation delay is specified at 3.5 ns, while turn-on delay reaches 4.9 ns. It functions reliably across an operating temperature range from -40 °C to 85 °C. The component is housed in a compact SOT-23-6 surface-mount package.
Verify the complete part number including the RE4 suffix to ensure compliance with specific environmental or manufacturing standards. Confirm the SOT-23-6 package type matches your PCB footprint requirements. Check the operating temperature range specification against your application's thermal conditions. Ensure input voltage levels are compatible with the LVC logic family thresholds before integration.
Select this component when a single three-input AND gate is required in a minimal footprint. The LVC series offers superior speed compared to older logic families while maintaining low power consumption. The wide voltage range supports systems transitioning between 1.8 V and 5 V domains. Verify that the 3.5 ns propagation delay meets your timing constraints for the target digital circuit design.
This device belongs to the SN74LVC1Gxx series of single-function gates designed for low-voltage CMOS applications. The LVC family is characterized by fast switching speeds and reduced power dissipation. The DBVR suffix indicates the tape and reel packaging format, suitable for automated surface-mount assembly processes in high-volume manufacturing environments.
The SN74LVC1G11DRYR serves as a functional substitute using a 6-SON package. Verify pinout compatibility and package dimensions before substitution. Ensure the alternative package supports your board layout constraints and thermal management requirements.
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