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SN74LVC2G17YEPR is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUF NON-INVERT 5.5V 6DSBGA. Review the specifications below when checking this part for your BOM.
The SN74LVC2G17YEPR is a dual Schmitt-trigger buffer from the Texas Instruments LVC logic family, designed for 1.65-V to 5.5-V VCC operation. It contains two independent buffers performing the Boolean function Y = A with distinct positive-going (VT+) and negative-going (VT-) input threshold levels. The device features Ioff circuitry to support partial-power-down mode by disabling outputs to prevent damaging backflow current. It provides ±24-mA output drive at 3.3 V and includes ESD protection exceeding 2000-V human-body model standards.
Verify the specific ordering suffix YEPR corresponds to the NanoStar WCSP package with large bumps and NRND status. Confirm that the component meets the required operating temperature range of -40°C to 85°C. Ensure design compatibility with the 6-pin DSBGA footprint and solder bump composition before finalizing procurement orders.
Select this component when dual buffered channels with Schmitt-trigger inputs are required within a minimal footprint. The LVC series offers low power consumption suitable for battery-operated devices. Consider the NRND status for long-term supply planning. Verify that the 0.23-mm large bump pitch fits the target PCB layout constraints.
This part belongs to the SN74LVC2G17 series of dual Schmitt-trigger buffers manufactured by Texas Instruments. It utilizes the NanoStar technology, which employs die-as-package construction for extreme miniaturization. The YEPR suffix specifically denotes the WCSP (YEP) package variant with large solder bumps, distinguishing it from standard SC-70 or SOT-23 packages.
SN74LVC2G17YZPR is an alternative within the same series using the NanoFree YZP package.
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