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SN74LVC3G04YZPR is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC INVERTER 3CH 3-INP 8DSBGA. Review the specifications below when checking this part for your BOM.
The SN74LVC3G04YZPR is a triple inverter gate integrated circuit from the Texas Instruments 74LVC family. It operates within a supply voltage range of 1.65 V to 5.5 V and features a maximum static current of 10 µA. The device provides output currents of 32 mA for both high and low states. Propagation delay is specified at 3.2 ns when operating at 5 V with a 50 pF load. It functions reliably across an industrial temperature range of -40°C to 85°C. The component is housed in an 8-DSBGA package, measuring 1.9x0.9 mm, designed for surface-mount applications.
Verify the specific suffix YZPR corresponds to the 8-DSBGA (1.9x0.9) package configuration during sourcing. Confirm RoHS compliance status and lead times directly with authorized distributors or Texas Instruments representatives prior to order placement. Ensure design-in documentation matches the exact part number variant to avoid pinout mismatches.
Select this component when space-constrained designs require multiple inverters in a minimal footprint. The LVC series offers compatibility with standard 3.3 V and 5 V logic levels while supporting lower 1.8 V operations. Consider the 3.2 ns propagation delay for timing-critical paths and verify that the 32 mA output current meets the driving requirements of the connected loads.
This device belongs to the SN74LVC3Gxx series of single-function logic gates. It shares the same logical function as the SN74LVC3G04DCUR but utilizes a distinct DSBGA package instead of VSSOP. The 74LVC family is characterized by high speed and low power consumption, making it suitable for battery-operated devices requiring efficient power management alongside fast switching performance.
The SN74LVC3G04DCUR serves as a functional equivalent with identical electrical specifications, differing only in the VSSOP-8 packaging. Verify mechanical fitment constraints before substitution, as the DSBGA and VSSOP footprints are not interchangeable without PCB layout modifications.
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