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SN74LVC541ADBRG4 is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUF NON-INVERT 3.6V 20SSOP. Review the specifications below when checking this part for your BOM.
The SN74LVC541ADBRG4 is an octal buffer and line driver featuring three-state outputs, manufactured by Texas Instruments. It operates within a supply voltage range of 1.65 V to 3.6 V and utilizes CMOS logic technology. The device provides non-inverting signal transmission with eight input and eight output lines. It is housed in a 20-pin TSSOP package designed for surface-mount applications. Key electrical characteristics include high-level and low-level output currents of 24 mA each, with a static current of 10 uA. The component supports an operating temperature range from -40°C to +125°C.
Verify the specific suffix 'G4' indicates lead-free compliance and RoHS status as per manufacturer documentation. Confirm the package type is TSSOP-20 and check for any specific environmental certifications required for your application. Ensure compatibility with existing PCB footprints before procurement.
Select this component when an octal buffer with three-state control is required for low-voltage digital systems. It is suitable for designs needing high drive current at 1.65 V or 3.3 V supplies. Consider the TSSOP-20 package constraints and thermal performance for high-temperature environments up to 125°C.
This part belongs to the SN74LVC541A family of octal buffers. The 'G4' suffix typically denotes lead-free packaging and RoHS compliance. It is functionally similar to other LVC series octal buffers but offers specific voltage and drive characteristics defined by the LVC logic family standards.
Check for direct pin-compatible substitutes within the same LVC family. Verify that alternative parts match the 1.65 V to 3.6 V voltage range and 24 mA drive current. Ensure the replacement maintains the three-state output functionality and TSSOP-20 package dimensions.
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