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TC74HC32AF(EL,F) is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is IC GATE OR 4CH 2-INP 14SOP. Review the specifications below when checking this part for your BOM.
The TC74HC32AF(EL,F) is a high-speed CMOS logic integrated circuit manufactured by Toshiba Semiconductor and Storage. It contains four independent 2-input OR gates housed in a 14-SOP surface-mount package. The device operates within a supply voltage range of 2V to 6V, supporting low logic levels from 0.5V to 1.8V and high logic levels from 1.5V to 4.2V. It features output currents of 5.2mA for both high and low states with a maximum static current of 1 µA. Propagation delay is specified at 13ns @ 6V, 50pF. Operating temperatures range from -40°C to 85°C.
Verify the specific suffix (EL,F) against official Toshiba documentation to confirm packaging type and reel specifications. Ensure compatibility with 14-SOP footprint requirements during PCB layout. Confirm RoHS compliance status through the manufacturer's latest environmental declaration before final procurement approval.
Select this component when four independent OR gates are required in a compact surface-mount form factor. Consider the 2V-6V operating range for compatibility with system power rails. Evaluate the 13ns propagation delay against timing constraints. Compare against other 74HC series variants if different package styles or temperature ranges are needed.
This part belongs to the 74HC series of high-speed CMOS logic devices produced by Toshiba Semiconductor and Storage. The 74HC32 family provides standard OR gate functionality. The TC74HC32AF variant specifically denotes the SOP package configuration. This series is designed for general digital logic applications requiring low power consumption and compatibility with various logic families.
The 74HC32D is listed as an alternative product from the same manufacturer. Verify pinout compatibility and electrical specifications before substitution. Check datasheet differences regarding package dimensions and thermal characteristics.
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