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TLP521-4GRSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISO 5.3KV 4CH TRANS 16-SMD. Review the specifications below when checking this part for your BOM.
The TLP521-4GRSM is a surface-mount optocoupler from Isocom Components, featuring four independent channels within a 16-SMD package. It utilizes an infrared LED input paired with NPN phototransistor outputs to provide electrical isolation. Key specifications include a maximum forward voltage of 1.3V, a peak reverse voltage of 70V for the output, and a high isolation voltage rating of 5300Vrms. The device operates reliably across a temperature range of -30°C to 100°C, ensuring stable performance in demanding electronic environments.
Verify that the specific suffix GRSM corresponds to the required surface-mount tape-and-reel packaging configuration rather than tube packaging. Confirm the pinout orientation matches the target PCB footprint design. Ensure the supplier provides traceability documentation consistent with Isocom Components manufacturing standards for this specific variant.
Select this component when multiple isolated channels are required in a space-constrained surface-mount application. The four-channel configuration reduces board space compared to discrete single-channel solutions. Verify that the NPN open-collector output type aligns with the downstream circuit requirements for pull-up resistor implementation.
This part belongs to the TLP521 series, which represents a family of general-purpose optocouplers designed for cost-effective isolation. The GRSM suffix indicates a specific surface-mount package variant, distinguishing it from through-hole DIP versions like the TLP521-4. This series is widely used in commercial electronics where standard isolation ratings suffice.
Direct substitutes may include other 16-pin quad-channel surface-mount optocouplers with matching 5300Vrms isolation and NPN outputs. Verify compatibility with existing PCB footprints and ensure equivalent current transfer ratios are maintained for signal integrity.
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