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TP65H070LDG is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Transphorm. Its product description is GANFET N-CH 650V 25A 3PQFN. Review the specifications below when checking this part for your BOM.
The TP65H070LDG is a 650V normally-off Gallium Nitride (GaN) FET from Transphorm's SuperGaN platform. It features an on-resistance of 72mΩ and is housed in a PQFN package with a drain tab for thermal management. The device operates within a junction temperature range of -55°C to +150°C. Key electrical characteristics include low gate charge, reduced crossover loss, and minimal reverse recovery charge, contributing to higher efficiency compared to silicon alternatives.
Verify the specific suffix 'DG' indicates the drain tab configuration distinct from source tab variants. Confirm active status and lead times through authorized distributors. Ensure ESD protection protocols are followed during handling due to the sensitivity of GaN gate structures. Cross-reference datasheet revisions for any updates to thermal or electrical parameters before final integration.
Select this component for applications requiring high power density and efficient thermal management in surface-mount designs. The drain tab variant suits systems where top-side cooling is preferred over traditional bottom-side heatsinking. Consider its low dynamic resistance and fast switching speeds for high-frequency converters aiming to minimize size and improve overall system efficiency beyond silicon capabilities.
This part belongs to Transphorm's Gen III SuperGaN product line, designed to replace silicon MOSFETs and SiC devices. It complements other TOLT and TOLL packaged variants, offering a robust solution for mid-to-high power applications. The technology leverages advanced GaN processes to achieve superior performance metrics while maintaining compatibility with standard manufacturing assembly processes.
Direct substitutes include the TP65H070LSG, which shares identical electrical specifications but utilizes a source tab instead of a drain tab for thermal dissipation. Designers must adjust PCB layout and thermal interface strategies when swapping between these two variants to maintain equivalent thermal performance.
Both devices share the same 650V rating and 72mΩ on-resistance. The primary difference is the thermal tab configuration: LDG features a drain tab for top-side cooling, while LSG features a source tab.
It is a normally-off (depletion mode) device, ensuring safe operation without a negative gate voltage required to turn off the transistor.
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