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UZZ9001,118 is listed in the Sensor And Detector Interfaces range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC SENSOR COND DUAL 24SO. Review the specifications below when checking this part for your BOM.
The UZZ9001 is a sensor conditioning electronic integrated circuit designed to process sinusoidal sine and cosine signals into a single linear output. It features two Sigma-Delta ADCs, a CORDIC algorithm for angle calculation, and an SPI interface. The device supports a 180° angle range with better than 1° accuracy when used with the KMZ41 sensor. Operating voltage ranges from 4.5 V to 5.5 V with a typical supply current of 51 mA. It provides 13-bit resolution and operates within a temperature range of -40 °C to +150 °C.
Verify component authenticity through authorized Philips Semiconductors channels or certified distributors. Confirm package integrity and pin alignment against SOT137-1 specifications. Review datasheet revisions as this document supersedes the May 2000 version. Ensure ESD handling protocols are followed due to 2 kV HBM sensitivity ratings during storage and installation.
Select this component when a mixed-signal solution is needed to convert analog sine/cosine inputs directly to digital SPI data. It is suitable for designs requiring on-chip angle calculation without external microcontrollers performing trigonometric functions. Consider the SO24 package constraints and verify that the host system can support the specific Motorola SPI mode (CPHA=1, CPOL=1) defined in the timing diagrams.
Originally manufactured by Philips Semiconductors, now part of NXP USA Inc., the UZZ9001 belongs to the family of sensor conditioning electronics. It was specifically engineered to simplify angle measurement architectures by integrating signal conversion and processing. The device remains relevant for legacy systems or specialized applications requiring robust analog front-end integration with digital output capabilities.
No direct public substitute part numbers are documented in the provided source material. Designers should evaluate modern sensor interfaces or standalone angle ICs if obsolescence is a concern, ensuring compatibility with existing SPI protocols and mechanical footprints.
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