SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AirBorn VSM-06-40-200-50-06-L1 is a rectangular MIL-DTL-83513 style plug connector from the verSI series. It features 6 rows and 40 columns, providing 240 positions with male pin contacts. The unit utilizes a 0.050-inch (1.27 mm) pitch and gold-plated beryllium copper terminals housed in a gray liquid crystal polymer body. Designed for through-hole board mount installation at a straight angle, it supports high-speed applications with a current rating of 2 A per contact and voltage ratings up to 200 V.
Verify the specific suffix 'L1' against official Molex/AirBorn documentation to confirm lead times and manufacturing status, as this variant may be subject to factory special order constraints. Ensure compatibility with mating receptacles within the same verSI series. Confirm that the through-hole termination method aligns with your PCB fabrication capabilities and thermal profiling requirements.
Select this component when a high-density 240-position solution is required in a standard rectangular footprint. The 0.050-inch pitch allows for significant circuit density while maintaining spacing standards. Choose the gold plating option if corrosion resistance and low contact resistance are critical for long-term performance in exposed environments.
This part belongs to the AirBorn verSI series, designed to meet MIL-DTL-83513 standards. The series offers various row and column configurations to accommodate different circuit counts. The VSM designation indicates a plug configuration with specific mounting and termination characteristics distinct from other series variants.
Direct replacements must match the 240 position count, 6-row layout, and 0.050-inch pitch. Verify that alternative manufacturers offer equivalent MIL-DTL-83513 compliance and identical mechanical dimensions for panel cutouts and mating interfaces.

Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read More