SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The VSM-06-50-100-50-04-L1 is a rectangular MIL-Spec connector from the AirBorn verSI series, manufactured by Molex. It features a 300-position configuration with 6 rows and 50 columns. The component utilizes male pin contacts with gold plating and phosphor bronze material. Designed for through-hole PCB mounting at a straight angle, it operates within a temperature range of -55°C to +125°C. The housing is constructed from liquid crystal polymer (LCP), providing a 0.050-inch pitch and compliance with MIL-DTL-83513 standards.
Verify the complete part number against official Molex documentation to ensure correct suffix alignment. Confirm that the specific ordering suffix matches the required board thickness and termination style. Request current manufacturer availability directly, as distribution channels may vary. Validate RoHS status and environmental compliance requirements prior to final procurement authorization.
Select this component when a high-density, vertically mounted rectangular connector is required for harsh environments. Ensure the PCB layout accommodates the 6-row by 50-column grid and through-hole termination. Verify that the operating temperature range meets system demands. Confirm compatibility with mating receptacles within the same verSI series family.
This part belongs to the AirBorn verSI series, designed for high-performance rectangular interconnects. The series supports various row and column configurations to meet diverse density needs. Manufactured under Molex, these connectors are engineered for reliability in demanding industrial and military sectors.
Consult official Molex cross-reference guides for verified substitutes. Ensure any replacement maintains identical MIL-DTL-83513 compliance and physical dimensions.

In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More