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The AirBorn VSM-08-10-200-50-00-L is a high-density, board-to-board connector system designed for demanding electronic applications. It features a vertical mating configuration with a 0.8mm pitch and dual-row arrangement. The component utilizes gold-plated contacts to ensure reliable signal transmission in high-frequency environments. This specific model includes a 200-position interface, engineered for robust mechanical stability and consistent electrical performance under vibration and thermal cycling conditions.
Verify the complete part number against official AirBorn documentation to confirm pin count, termination style, and housing material specifications. Ensure compatibility with mating header components regarding pitch and row configuration. Request certified test reports for environmental resilience if operating in extreme conditions.
Evaluate the required current carrying capacity and signal integrity needs against the connector's rated specifications. Consider the mechanical retention requirements and available board space for the vertical profile. Confirm that the mating environment supports the specified temperature range and vibration standards for long-term durability.
This component belongs to AirBorn's VSM series of high-performance connectors. The series is known for its rugged construction and suitability for harsh environments. The VSM line typically offers various configurations to meet diverse density and connectivity requirements in critical electronic systems.
Consult official AirBorn cross-reference guides for verified substitute part numbers. Ensure any replacement maintains identical pitch, pin count, and mounting characteristics. Verify that alternative components meet the same environmental and electrical performance standards.

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