Memory IC W25Q128FVCJQ product image

W25Q128FVCJQ

  • Description:IC FLASH 128MBIT SPI 24TFBGA
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tube

SKU:c3f2b8a76746 Category: Brand:

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W25Q128FVCJQ is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 128MBIT SPI 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W25Q128FVCJQ

  • Description:IC FLASH 128MBIT SPI 24TFBGA
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tube
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:128Mbit
  • Memory Organization:16M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:50µs, 3ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (6x8)
  • Access Time:-

Memory IC datasheet and documents for W25Q128FVCJQ

W25Q128FVCJQ

Memory IC Overview

The W25Q128FVCJQ is a 128-Mbit (16M x 8) NOR Flash memory IC manufactured by Winbond Electronics. It utilizes an SPI interface supporting Quad I/O and QPI modes with a clock frequency of 104 MHz. The device operates within a supply voltage range of 2.7V to 3.6V and features a 24-TFBGA (6x8) package. It supports non-volatile data storage with a wide operating temperature range from -40°C to 105°C.

Memory IC Feature Summary

  • Supports high-speed serial communication via SPI, Quad I/O, and QPI interfaces for efficient data transfer.
  • Provides reliable non-volatile storage with organized 16M x 8 bit capacity for persistent data retention.
  • Operates across an extended industrial temperature range suitable for diverse environmental conditions.

Memory IC Applications

  • Embedded systems requiring compact non-volatile code storage
  • Industrial control devices needing reliable data logging
  • Consumer electronics utilizing small form-factor memory solutions

Memory IC Procurement Notes

Verify the specific suffix JQ confirms the 24-TFBGA package and 105°C temperature grade against official datasheets. Confirm RoHS compliance status and check for any product change notices regarding lead time or packaging updates before finalizing orders.

Memory IC Selection Notes

Select this component when a 128-Mbit capacity is required in a low-profile BGA footprint. Ensure the design supports 2.7V-3.6V logic levels and SPI/QPI protocols. Compare pin compatibility and thermal performance against alternative packages like SOIC if board space allows.

Memory IC Part Context

This part belongs to the W25Q128 series of SpiFlash memories. It shares core architecture with other variants but differs in package type and temperature rating. The FVCJQ designation specifically indicates the TFBGA form factor and industrial temperature range distinct from consumer-grade counterparts.

Memory IC Replacement Considerations

Check for W25Q128FVCJF as a potential substitute with similar specifications. Verify package dimensions and pinout compatibility before substitution. Ensure electrical parameters match the original design requirements.

W25Q128FVCJQW25Q128FVCJQ

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