W632GG6KB12I

Memory IC Overview

The W632GG6KB12I is a 2 Gbit DDR3 SDRAM organized as 128M x 16. It supports a maximum operating frequency of 800 MHz (DDR3-1600) with a CAS latency range of 6 to 11. The device operates within a voltage range of 1.425 V to 1.575 V and features an industrial temperature rating from -40°C to +95°C. It utilizes a 96-ball WBGA package.

Memory IC Feature Summary

• Supports double data rate architecture with eight internal banks for concurrent operations.
• Includes programmable on-die termination and dynamic ODT modes for signal integrity.
• Features write leveling and multi-purpose registers for system timing calibration.
• Provides asynchronous reset functionality for power-up initialization sequences.

Memory IC Applications

• Industrial computing systems requiring extended temperature ranges
• High-speed memory subsystems utilizing DDR3-1600 interfaces
• Embedded applications needing low-power self-refresh capabilities

Memory IC Procurement Notes

Verify the specific ordering suffix against manufacturer documentation to confirm speed grade and temperature range compliance. Ensure that the procurement channel provides valid traceability for RoHS compliance and material declarations. Confirm package marking details match the physical component received.

Memory IC Selection Notes

Select this component when a 16-bit wide interface is required for 2 Gbit capacity. The industrial temperature range makes it suitable for harsh environments. Verify that the host controller supports the necessary DDR3-1600 timing parameters and voltage levels specified in the datasheet.

Memory IC Part Context

This part belongs to the Winbond W632GG6KB series of DDR3 SDRAM devices. It shares architectural similarities with other speed grades in the family, differing primarily in clock frequency limits and thermal specifications. The '12I' designation specifically indicates the industrial temperature variant compliant with DDR3-1600 standards.

Memory IC Replacement Considerations

Direct substitutes include the W632GG6KB-12 for commercial temperature operation or the W632GG6KB15I for lower frequency industrial requirements. Cross-vendor equivalents must be evaluated for pin compatibility and electrical parameter alignment.

Memory IC FAQ

What is the supported CAS Latency range for the W632GG6KB12I?

The device supports CAS Latencies of 6, 8, 10, and 11 cycles.

How does the device handle power-down states?

It supports both Precharged Power Down and Active Power Down modes, controlled via the CKE signal.