W638GU6QB12I TR

Memory IC Overview

The W638GU6QB12I TR is a Winbond dynamic random access memory component belonging to the DDR3L series. It provides a storage capacity of 8 Gbit with a data bus width of 16 bits, organized as 512 M x 16. The device supports a maximum clock frequency of 800 MHz and operates within a voltage range of 1.283 V to 1.45 V. It features an access time of 225 ps and is housed in a VFBGA-96 package suitable for surface mount installation. The industrial temperature rating spans from 0°C to +95°C.

Memory IC Feature Summary

• Supports low voltage operation within the DDR3L specification range
• High-density 8 Gbit storage architecture for advanced memory requirements
• Industrial temperature grade ensuring stability across specified thermal conditions

Memory IC Applications

• Industrial control systems requiring robust memory performance
• Embedded computing platforms utilizing high-speed data processing
• Consumer electronics devices demanding compact memory solutions

Memory IC Procurement Notes

Verify current manufacturing status directly with Winbond Electronics, as public records indicate this specific part number may be subject to discontinuation or end-of-life procedures. Confirm availability through authorized distributors and ensure compliance with RoHS directives. Check for moisture sensitivity levels and recommended reflow soldering profiles prior to integration into production lines.

Memory IC Selection Notes

Select this component when an 8 Gbit density is required alongside a 16-bit interface width. Ensure the design accommodates the VFBGA-96 footprint and supports the specified 1.283 V to 1.45 V power supply rails. Verify that the system environment remains within the 0°C to +95°C operating temperature range to maintain guaranteed performance specifications.

Memory IC Part Context

This part belongs to the W638GU6QB family of DDR3L SDRAMs manufactured by Winbond. It shares architectural similarities with other members like the W638GU6QB-12 but differs in packaging format, utilizing tape and reel delivery instead of trays. The series targets applications needing high bandwidth and density in a small form factor.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult manufacturer documentation for potential obsolescence management strategies or alternative series recommendations.