Memory IC W948D6FB2X5J product image

W948D6FB2X5J

  • Description:IC DRAM 256MBIT PARALLEL 200MHZ
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:db79e18e8dfe Category: Brand:

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W948D6FB2X5J is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 256MBIT PARALLEL 200MHZ. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W948D6FB2X5J

  • Description:IC DRAM 256MBIT PARALLEL 200MHZ
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR
  • Memory Size:256Mbit
  • Memory Organization:16M x 16
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.95V
  • Operating Temperature:-40°C ~ 105°C (TC)
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Access Time:5 ns

Memory IC datasheet and documents for W948D6FB2X5J

W948D6FB2X5J

Memory IC Overview

The W948D6FB2X5J is a 256Mb Mobile LPDDR SDRAM manufactured by Winbond Electronics. It features a 16-bit data bus width and supports a maximum clock frequency of 200 MHz. The device operates within a voltage range of 1.7 V to 1.95 V for both VDD and VDDQ. It utilizes a 60-ball VFBGA package and is designed for industrial temperature applications, functioning reliably between -40°C and +85°C.

Memory IC Feature Summary

  • Supports Partial Array Self-Refresh (PASR) and Automatic Temperature Compensated Self-Refresh (ATCSR) for power management
  • Features four internal banks enabling concurrent operations and interleaving to hide pre-charging time
  • Includes programmable output buffer driver strength and Data Mask (DM) functionality for write data control
  • Provides Deep Power Down Mode and Clock Stop capability during idle periods to minimize standby power consumption

Memory IC Applications

  • Mobile handheld devices requiring low-power memory solutions
  • Industrial embedded systems operating in extreme temperature environments
  • Portable consumer electronics utilizing mobile LPDDR interfaces

Memory IC Procurement Notes

Verify the specific suffix '2X5J' against official datasheets to confirm the exact speed grade and temperature rating. Confirm current availability status as this component may be subject to discontinuation or lifecycle changes. Ensure compatibility with existing PCB footprints and signal integrity requirements for the 60-ball VFBGA package before procurement.

Memory IC Selection Notes

Select this component when a 16-bit interface is required for 256Mb capacity at high speeds up to 200 MHz. Consider the industrial temperature range (-40°C to +85°C) for harsh environment deployments. Evaluate the need for advanced power-saving features like PASR and ATCSR if battery life or thermal management is critical for the target application design.

Memory IC Part Context

This part belongs to the W948D6FB series of Mobile LPDDR SDRAMs from Winbond. It shares architectural similarities with other variants in the family but differs in speed grades and packaging options. The x16 configuration distinguishes it from x32 versions which utilize a larger 90-ball package.

Memory IC Replacement Considerations

Direct substitutes include other W948D6FB variants with matching speed grades and packages. Verify pinout compatibility and electrical characteristics when considering cross-references from other manufacturers.

W948D6FB2X5JW948D6FB2X5J

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