Memory IC W971GG6SB-25 product image

W971GG6SB-25

  • Description:IC DRAM 1GBIT PARALLEL 84WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:5c8a88429d90 Category: Brand:

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W971GG6SB-25 is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 1GBIT PARALLEL 84WBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W971GG6SB-25

  • Description:IC DRAM 1GBIT PARALLEL 84WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR2
  • Memory Size:1Gbit
  • Memory Organization:64M x 16
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:84-TFBGA
  • Supplier Device Package:84-WBGA (8x12.5)
  • Access Time:57.5 ns

Memory IC datasheet and documents for W971GG6SB-25

W971GG6SB-25

Memory IC Overview

The W971GG6SB-25 is a 1 Gbit DDR2 SDRAM organized as 8,388,608 words x 8 banks x 16 bits. It supports transfer rates up to 800 Mbps (DDR2-800) compliant with the 5-5-5 or 6-6-6 specification. The device operates at VDD and VDDQ of 1.8V ± 0.1V within a commercial temperature range of 0°C to 85°C. Key electrical parameters include CAS Latencies of 3, 4, 5, 6, and 7, burst lengths of 4 and 8, and an average clock period ranging from 2.5 ns to 8.0 ns depending on latency settings.

Memory IC Feature Summary

  • Supports double data rate architecture for high-speed data transfers
  • Features differential clock inputs and source-synchronous data strobes
  • Includes On-Die Termination and Off-Chip Driver impedance adjustment
  • Provides auto-precharge and self-refresh modes for power management

Memory IC Applications

  • Embedded systems requiring high bandwidth memory
  • Industrial control modules operating in standard commercial environments
  • Communication equipment utilizing DDR2 interfaces

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required timing specifications. Confirm that the package type corresponds to the WBGA 84 Ball configuration. Ensure the operating temperature range aligns with the application environment requirements before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 16-bit wide interface is required for 1 Gbit capacity. Consider the -25I variant if industrial temperature support is necessary. Evaluate system power constraints against the specified IDD values for active and standby modes during design.

Memory IC Part Context

This part belongs to the Winbond W971GG6 series of DDR2 SDRAMs. It shares architectural similarities with other members like the W971GG6NB but differs in organization and interface standards. The series targets applications needing reliable synchronous dynamic random access memory solutions.

Memory IC Replacement Considerations

Check datasheets for alternative parts offering identical 16-bit width and 1 Gbit density. Verify compatibility regarding pinout, voltage levels, and timing parameters to ensure seamless integration without board redesign.

W971GG6SB-25W971GG6SB-25

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