WFM200S022XNN3

RF Transceiver Modules And Modems Overview

The WFM200S022XNN3 is an IEEE 802.11 b/g/n compliant Wi-Fi System-in-Package (SiP) module manufactured by Silicon Labs. It operates within the 2.412 GHz to 2.484 GHz frequency range with a data rate of 72.2 Mb/s. The module features an embedded high-efficiency antenna, integrated crystal, and shielding. Electrical specifications include a supply voltage range of 1.62 V to 3.6 V, maximum output power of 15.1 dBm, and transmission current of 145 mA. It utilizes an SPI interface and supports operating temperatures from -40°C to +105°C.

RF Transceiver Modules And Modems Feature Summary

• Complies with IEEE 802.11 b/g/n standards for wireless connectivity
• Integrates high-efficiency antenna, crystal, and electromagnetic shielding within a single package
• Supports extended ambient operating temperatures up to 105°C

RF Transceiver Modules And Modems Applications

• IoT sensor nodes requiring robust wireless communication
• Industrial control systems operating in extreme environments
• Smart home devices needing certified Wi-Fi integration

RF Transceiver Modules And Modems Procurement Notes

Verify RoHS compliance status through official documentation before procurement. Confirm that the specific suffix XNN3 corresponds to the tray packaging configuration as indicated in distributor catalogs. Ensure compatibility with host system voltage levels ranging from 1.62 V to 3.6 V. Check humidity sensitivity handling requirements during storage and assembly processes.

RF Transceiver Modules And Modems Selection Notes

Select this module when space-constrained designs require an integrated RF solution with built-in shielding and antenna efficiency. Consider the SPI interface requirement for host microcontroller connectivity. Evaluate thermal management needs given the wide operating temperature range and surface mount package dimensions of 6.5 mm x 6.5 mm.

RF Transceiver Modules And Modems Part Context

This component belongs to the WFM200S series of Wi-Fi SiP modules from Silicon Labs. The series is designed for applications demanding compact form factors and reliable wireless performance. The WFM200S022XNN3 variant specifically integrates passive components and shielding to simplify PCB layout and reduce electromagnetic interference in dense electronic assemblies.

RF Transceiver Modules And Modems Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.