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The AirBorn WG50SOR9SY is a rectangular MIL-DTL-55302 compliant board mount receptacle from the W Series. It features 50 positions arranged in three rows with a 2.54 mm pitch. The component utilizes gold-plated copper alloy socket contacts and a polyphenylene sulfide housing. Designed for through-hole termination, it operates at a current rating of 5 A and withstands voltages up to 1 kV. The unit supports an operating temperature range from -65 °C to +125 °C and offers an insulation resistance of 5 GOhms.
Verify specific ordering suffixes against official Molex/AirBorn documentation to ensure correct tail length and guide set inclusion. Confirm RoHS compliance status directly with the manufacturer as regulatory requirements may vary by production batch. Cross-reference datasheet revision levels to guarantee compatibility with mating plug components and PCB layout constraints before finalizing procurement orders.
Select this part when a right-angle, three-row receptacle with 50 circuits is required for MIL-DTL-55302 applications. Ensure PCB design accommodates the specific through-hole footprint and right-angle orientation. Verify that mating plugs match the socket contact gender and pitch specifications. Consider thermal management capabilities given the 125 °C maximum operating temperature limit for the intended application environment.
This component belongs to the AirBorn W Series, a line of rectangular connectors designed for mission-critical environments. The series emphasizes high density and reliability, often used in aerospace and defense sectors. The WG50SOR9SY specifically addresses needs for robust board-mount solutions with precise alignment features provided by the guide set mechanism.
Direct substitutes must match the 50-position count, three-row configuration, and 2.54 mm pitch. Verify that alternative parts maintain the same MIL-DTL-55302 compliance level and right-angle mounting style. Contact gender and plating material must be identical to ensure proper electrical interface and corrosion resistance in the target deployment scenario.

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