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XC3S50-4TQG144C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 97 I/O 144TQFP. Review the specifications below when checking this part for your BOM.
The XC3S50-4TQG144C is a Field Programmable Gate Array (FPGA) from the Spartan-3 family manufactured by AMD. It features 97 I/O pins, 50,000 gates, and 1,728 logic elements organized into 192 LABs/CLBs. The device includes 73,728 total RAM bits and operates within a supply voltage range of 1.14V to 1.26V. Packaged in a 144-LQFP surface-mount enclosure, it supports an operating temperature range of 0°C to 85°C TJ. This component represents a mid-range solution for embedded logic applications.
Verify component authenticity through authorized distributors or AMD direct channels. Confirm RoHS compliance status and check for End-of-Life (EOL) notices, as this part may be discontinued. Ensure storage conditions meet moisture sensitivity level requirements prior to assembly to prevent package damage during reflow soldering processes.
Select this FPGA for designs requiring moderate logic density with embedded processing capabilities. Compare against Spartan-3A variants for pin compatibility and feature enhancements. Evaluate power consumption profiles against Artix series alternatives if higher performance per watt is required for the specific application constraints.
This component belongs to the Spartan-3 FPGA family, which targets cost-sensitive embedded applications. It bridges basic logic needs with more complex processing tasks via integrated soft processors. The series is known for balancing performance with low power consumption, making it suitable for portable and industrial devices where size and energy efficiency are critical design factors.
Check for official AMD replacement recommendations due to potential EOL status. Consider Spartan-3AN for lower power options or Spartan-3A for enhanced features. Verify pin-to-pin compatibility before substituting with newer generation FPGAs to minimize PCB redesign efforts.
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