Soc System On Chip XCVC1502-1MSEVSVA2197 product image

XCVC1502-1MSEVSVA2197

$14,467.00
  • Description:IC VERSAL AI-CORE FPGA 2197BGA
  • Series:Versal™ AI Core

SKU:68e9f3c49c06 Category: Brand:

  
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XCVC1502-1MSEVSVA2197 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AI-CORE FPGA 2197BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVC1502-1MSEVSVA2197

  • Description:IC VERSAL AI-CORE FPGA 2197BGA
  • Series:Versal™ AI Core
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.3GHz
  • Primary Attributes:Versal™ AI Core FPGA, 800k Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:2197-BFBGA, FCBGA
  • Supplier Device Package:2197-FCBGA (45x45)

Soc System On Chip datasheet and documents for XCVC1502-1MSEVSVA2197

XCVC1502-1MSEVSVA2197

Soc System On Chip Overview

The AMD XCVC1502-1MSEVSVA2197 is a Versal Prime Adaptive SoC featuring an FCBGA-2197 package. It integrates dual-core Arm Cortex-A72 and dual-core Arm Cortex-R5F processors with programmable logic. The device operates at a core voltage of 800 mV within a commercial temperature range of 0°C to +100°C. This component belongs to the Versal Prime series, designed for high-performance system-on-chip applications requiring integrated processing and adaptive infrastructure.

Soc System On Chip Feature Summary

  • Integrates dual-core Arm Cortex-A72 and dual-core Arm Cortex-R5F processors
  • Features Versal Prime adaptive infrastructure with programmable NoC
  • Supports SMD/SMT installation in FCBGA-2197 package

Soc System On Chip Applications

  • Data center network acceleration
  • SmartNIC implementations
  • 5G xHaul networking

Soc System On Chip Procurement Notes

Verify part authenticity through authorized AMD distributors or direct manufacturer channels. Confirm RoHS compliance status and moisture sensitivity level (MSL) prior to PCB assembly. Ensure proper ESD handling protocols are followed during storage and installation to maintain component integrity.

Soc System On Chip Selection Notes

Select this model when Versal Prime architecture meets performance requirements. Verify that the FCBGA-2197 footprint aligns with the target PCB design. Confirm thermal management capabilities support the specified operating temperature range of 0°C to +100°C for the intended environment.

Soc System On Chip Part Context

This component is part of the AMD/Xilinx Versal Prime family, distinct from the AI Core and Premium series. It targets high-performance computing and networking markets. The specific suffix indicates the speed grade, package type, and operating temperature range defined by the manufacturer.

Soc System On Chip Replacement Considerations

Direct substitutes include other XCVC1502 variants with compatible packages such as XCVC1502-2MLEVSVA2197 or XCVC1502-2MSEVSVA1596. Verify pin compatibility and electrical specifications before substitution.

XCVC1502-1MSEVSVA2197XCVC1502-1MSEVSVA2197
$14,467.00
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