Soc System On Chip XCVE1752-2MSINSVG1369 product image

XCVE1752-2MSINSVG1369

$20,118.44
  • Description:IC VERSAL AI-CORE FPGA 1369BGA
  • Series:Versal™ AI Core

SKU:cf9db2aea706 Category: Brand:

  
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XCVE1752-2MSINSVG1369 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AI-CORE FPGA 1369BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVE1752-2MSINSVG1369

  • Description:IC VERSAL AI-CORE FPGA 1369BGA
  • Series:Versal™ AI Core
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.4GHz
  • Primary Attributes:Versal™ AI Edge FPGA, 1M Logic Cells
  • Operating Temperature:-40°C ~ 110°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1369-BFBGA, FCBGA
  • Supplier Device Package:1369-FCBGA (35x35)

Soc System On Chip datasheet and documents for XCVE1752-2MSINSVG1369

XCVE1752-2MSINSVG1369

Soc System On Chip Overview

The AMD XCVE1752-2MSINSVG1369 is a System-on-Chip FPGA from the Versal Premium series, designed for high-performance edge and data center applications. It features an FCBGA-1369 package with a maximum operating temperature of +110°C and a minimum of -40°C. The device operates at a core voltage of 700 mV. This component integrates programmable logic, AI Engines, and a processing system to support complex signal processing and machine learning inference tasks.

Soc System On Chip Feature Summary

  • Integrates Versal Adaptive SoC architecture combining programmable logic, AI Engines, and Arm-based processors
  • Supports deterministic real-time control and safety-critical applications through integrated Cortex-R5F cores
  • Provides scalable AI inference acceleration via dedicated AI Engine arrays optimized for low-latency workloads

Soc System On Chip Applications

  • Automotive sensor fusion and autonomous driving systems
  • Industrial automation and predictive maintenance platforms
  • Aerospace and defense multi-mission payloads
  • Healthcare imaging and diagnostic equipment

Soc System On Chip Procurement Notes

Verify the specific suffix INS against official AMD documentation to confirm pinout and electrical characteristics. Ensure compatibility with existing board designs regarding the FCBGA-1369 footprint. Confirm thermal management requirements for the +110°C junction temperature rating during system integration.

Soc System On Chip Selection Notes

Select this model when high-density AI inference and deterministic real-time processing are required in a single chip. Compare performance metrics against lower-tier Versal models if power constraints are critical. Validate that the 1369-ball package fits within the mechanical enclosure and PCB layer stack-up limitations of the target design.

Soc System On Chip Part Context

This part belongs to the AMD Versal Premium family, which targets demanding edge computing scenarios requiring both high throughput and low latency. It sits above the Versal AI Edge series in terms of resource density and processing capabilities, offering enhanced scalability for complex heterogeneous workloads.

Soc System On Chip Replacement Considerations

Check for direct cross-references within the Versal Premium lineup. Verify if XCVE1752 variants with different speed grades or package options serve as functional equivalents without redesigning the carrier board.

XCVE1752-2MSINSVG1369XCVE1752-2MSINSVG1369
$20,118.44
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