XCVM1302-1MLINSVF1369

Soc System On Chip Overview

The AMD XCVM1302-1MLINSVF1369 is a Versal Premium Adaptive SoC FPGA featuring a 4072-ball FCBGA package. It integrates approximately 5,824 K system logic units (5.8M framework logic), 2,668,800 LUTs, and 11,520 DSP engines. The processing subsystem includes dual Arm Cortex-A72 cores for application tasks and dual Cortex-R5F cores for real-time control. It supports high-speed GT transceivers up to 58 Gb/s and 112 Gb/s PAM4, enabling PCIe Gen5 and multi-lane Ethernet connectivity.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining programmable logic, AI Engine vector processors, and Arm scalar processors on a single chip.
• Integrated DDR memory controllers supporting high-bandwidth interfaces such as LPDDR5 and DDR5.
• Advanced NoC interconnect linking compute engines, logic, and I/O for low-latency data movement.
• Support for hardened IP blocks including PCIe Gen5/Gen4 and multi-rate Ethernet MACs.

Soc System On Chip Applications

• Data center network acceleration and virtual switching
• High-performance computing and AI inference
• 5G xHaul and optical transport networks
• Radar and advanced signal processing systems

Soc System On Chip Procurement Notes

Verify the specific ordering part number against official AMD documentation to ensure correct speed grade and package variant. Confirm that the required development tools, such as Vivado and Vitis, are compatible with the selected Versal device family. Ensure supply chain partners provide genuine components with traceability records to mitigate counterfeit risks in critical infrastructure deployments.

Soc System On Chip Selection Notes

Select this model when high-density logic resources and significant AI Engine capacity are required for complex parallel processing. Evaluate thermal requirements carefully due to the high pin count and power density of the 4072-ball FCBGA package. Compare against Versal Prime or Edge series if lower cost or different I/O speeds suffice, ensuring the chosen device meets the specific bandwidth and latency constraints of the target application.

Soc System On Chip Part Context

This component belongs to the AMD Versal Premium series, designed for demanding applications requiring substantial computational throughput and large-scale data handling. It represents a tier above the Versal Prime series in terms of logic density and AI Engine tile count, targeting enterprise-grade infrastructure where performance and scalability are paramount over cost sensitivity.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and pinout may include other XCVM1xxx variants with different speed grades or temperature ranges. Cross-series migration to Versal Prime requires re-evaluation of resource availability and I/O compatibility. Verify pin-to-pin compatibility and software toolchain support before substituting with alternative SKUs from the Versal portfolio.