XCVM1802-1MLIVSVD1760

Soc System On Chip Overview

The AMD XCVM1802-1MLIVSVD1760 is a Versal Prime Series Adaptive SoC housed in a 1760-pin FCBGA package. It integrates dual-core Arm Cortex-A72 and dual-core Arm Cortex-R5F processors with programmable logic containing approximately 1.9 million system logic cells. The device supports high-speed I/O including PCIe Gen4, SFP28, QSFP28, and RJ-45 Ethernet interfaces. It features integrated DDR4 and LPDDR4 memory controllers and provides extensive connectivity options for networking and storage acceleration applications.

Soc System On Chip Feature Summary

• Combines software-programmable silicon infrastructure with dedicated compute engines for diverse workload acceleration
• Integrates programmable network-on-chip and integrated shell to enable rapid hardware and software differentiation
• Supports multiple optical and copper interface standards for flexible connectivity in data center environments

Soc System On Chip Applications

• Data center network and storage acceleration
• SmartNIC implementations
• 5G xHaul infrastructure
• Nx100G Ethernet and OTN networking equipment
• Communications test and measurement systems

Soc System On Chip Procurement Notes

Verify the specific suffix of the part number against official AMD documentation to confirm temperature range, speed grade, and packaging details. Ensure compatibility with required development tools such as Vitis and Vivado before procurement. Confirm availability through authorized distributors as lead times may vary based on manufacturing schedules.

Soc System On Chip Selection Notes

Select this component when requiring a balance of high-performance processing and flexible programmable logic for networking tasks. Compare against other Versal Prime models based on specific DSP engine counts and I/O pin requirements. Ensure the selected speed grade meets the timing constraints of the target application design.

Soc System On Chip Part Context

This part belongs to the AMD Versal Prime series, designed for mid-range adaptive computing needs. It offers a cost-effective solution for applications requiring significant parallel processing capabilities without the full resource count of higher-tier Premium or HBM series devices. It serves as a key component in modern high-throughput communication systems.

Soc System On Chip Replacement Considerations

Direct replacements are limited within the same family. Consider the XCVM1802-2MSEVSVA2197 or XCVM1802-2MSEVSVD1760 if pinout and performance specifications align. Verify that any substitute maintains the required package dimensions and thermal characteristics for the existing board design.