Soc System On Chip XCVM1802-2MLEVSVA2197 product image

XCVM1802-2MLEVSVA2197

$11,706.63
  • Description:IC VERSAL AICORE FPGA 2197BGA
  • Series:Versal™ Prime

SKU:f63eac1fc470 Category: Brand:

  
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XCVM1802-2MLEVSVA2197 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AICORE FPGA 2197BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVM1802-2MLEVSVA2197

  • Description:IC VERSAL AICORE FPGA 2197BGA
  • Series:Versal™ Prime
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.4GHz
  • Primary Attributes:Versal™ Prime FPGA, 1.9M Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:2197-BFBGA, FCBGA
  • Supplier Device Package:2197-FCBGA (45x45)

Soc System On Chip datasheet and documents for XCVM1802-2MLEVSVA2197

XCVM1802-2MLEVSVA2197

Soc System On Chip Overview

The XCVM1802-2MLEVSVA2197 is a Versal Prime Series System-on-Chip FPGA manufactured by AMD. It integrates dual-core ARM Cortex-A72 and dual-core ARM Cortex-R5F processors with programmable logic resources. The device operates at maximum clock frequencies of 600 MHz for the application processor and 1.4 GHz for the real-time processor. It utilizes a 2197-ball FCBGA package designed for surface-mount installation.

Soc System On Chip Feature Summary

  • Versal Prime adaptive SoC architecture combining software-programmable infrastructure with specialized compute engines
  • Integrated dual-core ARM Cortex-A72 and dual-core ARM Cortex-R5F processing units
  • Supports high-speed connectivity including PCIe Gen4, HDMI, SFP28, QSFP28, and RJ-45 Ethernet interfaces

Soc System On Chip Applications

  • Data center networking and storage acceleration
  • SmartNIC applications
  • 5G xHaul networks
  • Nx100G Ethernet and OTN network systems
  • Communication test equipment

Soc System On Chip Procurement Notes

Verify component authenticity through authorized distribution channels. Confirm RoHS compliance status and moisture sensitivity level (MSL 4) prior to assembly. Ensure supply chain stability due to restricted availability in certain regions. Validate specific ordering suffixes against official datasheets to confirm pinout and electrical characteristics match design requirements.

Soc System On Chip Selection Notes

Select this model when requiring the Versal Prime architecture for hardware/software system differentiation. Consider the integrated shell and NoC capabilities for rapid development. Evaluate the 1.9M logic unit capacity against target workload complexity. Verify that the 2197 BGA package dimensions fit the target PCB layout constraints.

Soc System On Chip Part Context

This component belongs to the AMD Versal Prime series, distinct from the AI Core series which includes additional AI Engines. The XCVM1802 variant provides 1.9 million logic units and is optimized for high-performance computing markets requiring flexible I/O options and efficient data processing without dedicated AI engine arrays.

Soc System On Chip Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Cross-referencing requires consulting official AMD selection guides for equivalent logic density and package compatibility within the Versal Prime family.

XCVM1802-2MLEVSVA2197XCVM1802-2MLEVSVA2197
$11,706.63
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