XCZU1EG-2SFVC784I

Soc System On Chip Overview

The XCZU1EG-2SFVC784I is a Zynq UltraScale+ MPSoC device from AMD, integrating heterogeneous processing systems with programmable logic. It features seven cores: dual ARM Cortex-A53 application processors, dual ARM Cortex-R5 real-time processors, and an ARM Mali-400 MP2 GPU. The FPGA fabric provides 81,900 logic elements (4,680 ALMs) and 3.8 Mbit of embedded memory. Key electrical parameters include a core voltage of 850 mV, operating temperatures from -40°C to +100°C, and 180 I/O pins in a 784-FCBGA package.

Soc System On Chip Feature Summary

• Heterogeneous Processing System: Dual-core ARM Cortex-A53 MPCore, dual-core ARM Cortex-R5F, and ARM Mali-400 MP2 GPU
• Programmable Logic: 81,900 Logic Elements (LEs), 4,680 Adaptive Logic Modules (ALMs), and 3.8 Mbit embedded memory
• Package and Interface: 784-ball FCBGA package with 180 user I/Os
• Operating Conditions: Industrial temperature range (-40°C to +100°C) with 850 mV core voltage

Soc System On Chip Applications

• Industrial motor control and sensor fusion
• Low-cost ultrasound imaging systems
• Traffic engineering applications

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating during procurement. Confirm availability status as distribution channels may report regional sales restrictions. Ensure compatibility with required PCB footprint for the 784-FCBGA package. Check for moisture sensitivity level requirements prior to soldering.

Soc System On Chip Selection Notes

Select this model for applications requiring moderate FPGA resources combined with video processing capabilities via the Mali-400 MP2. Compare against the CG series if GPU support is unnecessary to optimize cost. Verify that the 180 I/O count meets interface requirements. Consider the 850 mV core voltage for power supply design constraints.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG series, designed for devices needing quad-core or dual-core A53 performance with integrated graphics. It shares the 784-FCBGA form factor with other variants like the XCZU3EG but offers lower logic density (81.9K LEs vs 154.3K LEs). The EG series targets infrastructure and aerospace markets.

Soc System On Chip Replacement Considerations

Direct functional substitutes within the same package include XCZU1EG-1SFVC784I (lower speed grade) or XCZU1CG-2SFVC784I (no GPU). For higher logic capacity, consider the XCZU3EG-L2SFVC784E, though pin counts and I/O configurations differ.