XCZU3EG-1UBVA530I

$507.88

Description：IC SOC CORTEX-A53 530BGA
Series：-

SKU:b1aff87509f4 Category: System On Chip (SoC) Brand: AMD

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Product introduction

XCZU3EG-1UBVA530I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A53 530BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU3EG-1UBVA530I

Description：IC SOC CORTEX-A53 530BGA
Series：-
Mfr：AMD
Package：Tray
Architecture：MPU, FPGA
Core Processor：Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size：-
RAM Size：256KB
Peripherals：DMA, WDT
Connectivity：CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed：500MHz, 1.2GHz
Primary Attributes：Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature：-40°C ~ 100°C (TJ)
Grade：-
Qualification：-
Package / Case：530-WFBGA, FCBGA
Supplier Device Package：530-FCBGA (16x9.5)

Soc System On Chip datasheet and documents for XCZU3EG-1UBVA530I

XCZU3EG-1UBVA530I

Soc System On Chip Overview

The XCZU3EG-1UBVA530I is a Zynq UltraScale+ MPSoC featuring a quad-core ARM Cortex-A53 processor and dual-core ARM Cortex-R5 real-time processor. It integrates approximately 154,000 logic cells within the programmable logic fabric. The device operates at clock speeds up to 500 MHz for the A53 cores and 1.2 GHz for the R5 cores. It includes 256 KB of embedded RAM and supports various interfaces including Ethernet, USB OTG, SPI, I2C, UART, and CANbus. The component is housed in a 530-pin FCBGA package with dimensions of 16x9.5 mm.

Soc System On Chip Feature Summary

Combines quad-core application processing with dual-core real-time control capabilities
Integrates high-density programmable logic for custom hardware acceleration
Supports diverse connectivity standards including Ethernet and USB OTG

Soc System On Chip Applications

Wired and wireless infrastructure systems
Data center networking equipment
Aerospace and defense platforms

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' against official AMD documentation to confirm industrial temperature range compliance (-40°C to +100°C). Ensure the ordering part number matches the exact speed grade and package variant required for the design. Cross-reference with current EOL or PCN notices from AMD to confirm active production status before finalizing procurement plans.

Soc System On Chip Selection Notes

Select this model when quad-core processing performance is required for infrastructure or data center applications. Compare against CG series devices if lower core counts suffice for cost-sensitive designs. Verify that the 530-ball package fits the board layout constraints and that the thermal dissipation requirements for the 16nm FinFET+ process are met by the system design.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC family, specifically the EG series designed for higher-performance computing tasks. It utilizes 16nm FinFET+ technology to deliver scalable processing power. The EG series distinguishes itself from the CG and EV series by offering four application processor cores, targeting demanding computational loads in network and storage environments.