Soc System On Chip XCZU57DR-1FFVE1156I product image

XCZU57DR-1FFVE1156I

$14,256.63
  • Description:IC ZUP RFSOC A53 FPGA 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC DR

SKU:61c73beb942d Category: Brand:

  
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XCZU57DR-1FFVE1156I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC ZUP RFSOC A53 FPGA 1156BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU57DR-1FFVE1156I

  • Description:IC ZUP RFSOC A53 FPGA 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC DR
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:-
  • Peripherals:DDR, DMA, PCIe, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 1.2GHz
  • Primary Attributes:Zynq® UltraScale+™ RFSoC
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

Soc System On Chip datasheet and documents for XCZU57DR-1FFVE1156I

XCZU57DR-1FFVE1156I

Soc System On Chip Overview

The XCZU57DR-1FFVE1156I is a Zynq UltraScale+ RFSoC device manufactured by AMD. It integrates a quad-core ARM Cortex-A53 processor and a dual-core ARM Cortex-R5 processor with CoreSight debug infrastructure. The FPGA fabric includes 42,080 Adaptive Logic Modules (ALMs) and 352 user I/Os. Key specifications include 24 GTY transceivers, 32.1 Mbit of embedded block RAM, and 8.8 Mbit of distributed RAM. The device operates within a junction temperature range of -40°C to +100°C and utilizes a 1156-pin FCBGA package.

Soc System On Chip Feature Summary

  • Integrated quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors
  • FPGA fabric with 42,080 ALMs and 352 I/Os
  • 24 high-speed GTY transceivers for RF applications
  • 32.1 Mbit embedded block RAM and 8.8 Mbit distributed RAM

Soc System On Chip Applications

  • Software-defined radio systems
  • High-performance test and measurement equipment
  • Advanced radar signal processing

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating (-40°C to +100°C). Confirm the package type is 1156-FCBGA (35x35 mm). Check for export control restrictions as this product may require additional documentation for shipment from the United States. Ensure compatibility with required power supply voltages, including the 850 mV core voltage.

Soc System On Chip Selection Notes

Select this model when both high-level processing via ARM cores and high-throughput data conversion via integrated ADCs/DACs are required. Compare against the XCZU55DR variant if lower logic density is sufficient. Verify that the 1156-pin footprint fits the target PCB design. Consider the L1 cache configuration of 2 x 32 kB instruction and 2 x 32 kB data memory for the A53 cores.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ RFSoC family, designed for radio frequency applications. It combines programmable logic with processing systems and mixed-signal capabilities. The 'DR' designation typically refers to devices with integrated RF data converters. It serves as an evolution in the Zynq portfolio, targeting complex wireless infrastructure.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package and speed grade should be verified against the official AMD Zynq UltraScale+ RFSoC Selection Guide. Cross-model comparisons should focus on ALM counts and transceiver availability.

XCZU57DR-1FFVE1156IXCZU57DR-1FFVE1156I
$14,256.63
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