XCZU57DR-1FSVE1156I

Soc System On Chip Overview

The XCZU57DR-1FSVE1156I is a Zynq UltraScale+ RFSoC device manufactured by AMD. It integrates a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 processor, and programmable logic on a single chip. The device utilizes an FCBGA-1156 package with a 35x35 mm footprint. It supports industrial operating temperatures ranging from -40°C to +100°C TJ. Key specifications include 256KB of RAM and support for high-speed data conversion interfaces typical of the RFSoC architecture.

Soc System On Chip Feature Summary

• Integrates quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors with CoreSight debug infrastructure
• Features Zynq UltraScale+ RFSoC architecture for combined processing and RF data conversion
• Available in 1156-FCBGA (35x35) package suitable for SMD/SMT installation
• Rated for industrial temperature range (-40°C to +100°C TJ)

Soc System On Chip Applications

• Software-defined radio systems
• Advanced radar signal processing
• High-performance communication infrastructure

Soc System On Chip Procurement Notes

Verify component authenticity through authorized AMD distributors or direct manufacturer channels. Confirm RoHS compliance status and Moisture Sensitivity Level (MSL 4) handling requirements prior to assembly. Check for specific export control classifications if applicable to your region. Ensure supply chain documentation matches the exact suffix 'I' for industrial grade temperature rating.

Soc System On Chip Selection Notes

Select this model when requiring integrated RF transceiver capabilities alongside ARM processing cores. Compare against other XCZU57 variants based on speed grades ('1') and package options. Verify that the 1156-ball count meets I/O requirements. Consider thermal management solutions due to the high integration density of the RFSoC platform.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ RFSoC family, designed for applications demanding high throughput and low latency. It differs from standard MPSoC devices by including integrated ADCs and DACs directly connected to the FPGA fabric. The 'DR' suffix typically denotes specific resource configurations within the RFSoC lineup.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements are limited within the same speed grade and package. Evaluate XCZU57 variants with different suffixes only if electrical characteristics match. Cross-family migration to larger RFSoC devices may require schematic and layout redesign.