Soc System On Chip XCZU5EG-3FBVB900E product image

XCZU5EG-3FBVB900E

$3,804.81
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:d890d001e74f Category: Brand:

  
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XCZU5EG-3FBVB900E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A53 900FCBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU5EG-3FBVB900E

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.5GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

Soc System On Chip datasheet and documents for XCZU5EG-3FBVB900E

XCZU5EG-3FBVB900E

Soc System On Chip Overview

The AMD XCZU5EG-3FBVB900E is a Zynq UltraScale+ MPSoC EG series device featuring an FPGA fabric with over 256K logic cells and a processing system comprising quad-core ARM Cortex-A53 processors, dual-core ARM Cortex-R5 processors, and an ARM Mali-400 MP2 GPU. It utilizes a 900-ball FCBGA package and supports maximum clock frequencies of 600 MHz for the A53 cores and 1.5 GHz for the R5 cores. The component includes 5.1 Mbit of embedded memory and operates within a junction temperature range of 0°C to 100°C.

Soc System On Chip Feature Summary

  • Integrated Processing System: Quad-core ARM Cortex-A53 MPCore (up to 600 MHz), dual-core ARM Cortex-R5 MPCore (up to 1.5 GHz), and ARM Mali-400 MP2 GPU.
  • FPGA Fabric: Contains over 256K logic cells, 14,640 Adaptive Logic Modules (ALMs), and 16 high-speed transceivers.
  • Memory Resources: Includes 5.1 Mbit of embedded block RAM and distributed RAM capabilities.
  • Package and Thermal: Delivered in a 900-ball FCBGA package (31x31 mm) suitable for surface mount applications.

Soc System On Chip Applications

  • Industrial automation and control systems
  • Medical imaging devices
  • Test and measurement equipment

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix '3' against the official AMD datasheet to confirm the exact frequency bins and timing specifications. Ensure that the required I/O voltage levels and power sequencing requirements align with the target board design before procurement.

Soc System On Chip Selection Notes

Select this model when a balance of moderate FPGA resources and robust processing capabilities is required. Compare against the XCZU5CG variant if higher logic density or different memory configurations are needed. Verify that the 900-ball BGA footprint matches the PCB layout constraints.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG family, which targets cost-sensitive embedded applications. It shares the same silicon architecture as other EG variants but differs in speed grading and package options. The EG series typically offers optimized performance for general-purpose embedded computing tasks.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package may include other speed grades of the XCZU5EG series, such as XCZU5EG-1FBVB900E or XCZU5EG-2FBVB900E, provided the electrical characteristics meet the system requirements.

XCZU5EG-3FBVB900EXCZU5EG-3FBVB900E
$3,804.81
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