ZLTMM-105-65-G-D-315

Headers, Male Pins Overview

The ZLTMM-105-65-G-D-315 is a board stacking connector manufactured by Samtec Inc. It features 10 contacts arranged in 2 rows with male pin terminals. The connector utilizes a straight, through-hole solder termination method and includes shrouding for alignment. It is RoHS compliant and designed for vertical mounting on printed circuit boards.

Headers, Male Pins Feature Summary

• Flexible stack design allows modification of pin lengths and adjustment of the insulator body position in 0.005-inch increments
• Shrouded construction provides enhanced guidance for blind-mating applications involving up to 50 contacts
• Compatible with .020-inch (0.50 mm) square post terminal systems for reliable interconnection

Headers, Male Pins Applications

• Blind-mating applications requiring precise alignment
• Board-to-board connections with variable component heights
• Vertical assembly configurations in dense electronic layouts

Headers, Male Pins Procurement Notes

Verify the specific suffix codes against official Samtec documentation to ensure correct pin length and insulator positioning. Confirm RoHS compliance status and material specifications match project requirements before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when variable stack height adjustment is necessary within a 2.00 mm pitch system. Ensure the mating interface supports .020-inch square posts and that the shrouded design aligns with the required blind-mating constraints.

Headers, Male Pins Part Context

This part belongs to the ZLTMM series of Flex Stack connectors. It is characterized by its 2.00 mm spacing and shrouded header design. The series is engineered for high-density applications requiring flexible mechanical adjustments during assembly.

Headers, Male Pins Replacement Considerations

Consult official Samtec substitution guides for compatible alternatives. Verify that any substitute maintains the 2-row, 10-position configuration and shrouded structural integrity.